Sony and Tokyo Tech Make Chip Capable of 6.3 Gb/s Millimeter-Wave Wireless Transfer
 

Sony Corporation today announced that the National University Corporation, Tokyo Institute of Technology and Sony have jointly developed a radio frequency ("RF") LSI and a baseband ("BB") LSI that enables millimeter-wave wireless data transfer at the world's fastest rate of 6.3 Gb/s. This technological achievement was adopted for presentation at the International Solid-State Circuits Conference (ISSCC) to be held in San Francisco from February 19, 2012 as academic paper No. 12.3 wherein details of the technology will be disclosed.

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