Stefan Mileschin

Higher capacity memory modules with fewer chips

SK Hynix has added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalogue which means the outfit can build high-capacity memory modules using fewer chips; it can also construct 256 GB DDR4 memory modules for ultra-high-end servers.

According to Anandtech memory makers already build high-capacity DRAM components by stacking two or four 8 Gb memory dies vertically using TSVs to get 16 Gb and 32 Gb components, then use such chips to build memory modules featuring 64 GB and 128 GB density.

http://fudzilla.com/news/memory/4550...-gb-ddr4-chips