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SK Hynix Launches 72-Layer 256 Gb 3D TLC NAND with Increased Performance
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SK Hynix Launches 72-Layer 256 Gb 3D TLC NAND with Increased Performance
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16th April 2017, 06:25
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| [M] Reviewer  Join Date: May 2010 Location: Romania
Posts: 148,578
 |  SK Hynix Launches 72-Layer 256 Gb 3D TLC NAND with Increased Performance SK Hynix has formally introduced its fourth-generation 3D NAND memory chips with 72 layers. Initially, the 3D TLC flash chips will be offered in 256 Gb configurations, but by the end of the year the manufacturer plans to introduce 72-layer 3D TLC NAND devices with 512 Gb capacities. All of SK Hynix’s fourth-gen 3D NAND chips will feature a larger block size, a lower programming time and a faster interface, which is expected to result in higher performance levels compared to the company's third-gen ICs. http://www.anandtech.com/show/11267/...tlc-nand-chips |
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