jmke

SANDISK AND TOSHIBA are teaming up in a quest to finally bring some long awaited re-writeable 3D memory to market.

The news broke as Sandisk filed a U.S. stock market regulator report late on Tuesday, which notes that the two firms will contribute to and cross license technology for 3D memory chip development and production. About time too.

The 3D memory chip dream actually goes way back, with a company called Matrix already having discovered how to stack memory arrays vertically and not just horizontally, back in 2001. The discovery, which had incredible potential for lowering costs and boosting the amounts of memory able to be stored on a chip significantly, sadly never really took off, despite Matrix’s partnership with Taiwan Semiconductor Manufacturing (TSMC).

http://www.theinquirer.net/gb/inquir...team-3d-memory

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