Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

Stefan Mileschin · 25th October 2019, 08:50

Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interface, thus providing high performance memory for mainstream handsets in a cost-effective form-factor.

Samsung’s UFS-based multichip packages (uMCPs) integrate 10 GB or 12 GB of LPDDR4X-4266 memory (made using the company’s 2nd Generation 10nm-class process technology) as well as NAND flash storage featuring a UFS 3.0 interface. Since both new uMCP modules incorporate four DRAM devices, they will allow the latest SoCs with quad-channel LPDDR4X memory controllers to reach up to 34.1 GB/s memory bandwidth. Meanwhile on the NAND side of matters, Samsung's official announcement doesn't list what storage capacities will be available there, but the company has commented that they can provide the uMCPs in a variety of capacities.

Meanwhile, the new uMCP devices are also mechanically compatible with Samsung's previous-generation 8GB uMCPs, utilizing the same 254FBGA package.

https://www.anandtech.com/show/15022...ufs-30-storage

25th October 2019, 08:50	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 148,553	Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12 GB of LPDDR4X DRAM as well as NAND flash storage with a UFS 3.0 interface, thus providing high performance memory for mainstream handsets in a cost-effective form-factor. Samsung’s UFS-based multichip packages (uMCPs) integrate 10 GB or 12 GB of LPDDR4X-4266 memory (made using the company’s 2nd Generation 10nm-class process technology) as well as NAND flash storage featuring a UFS 3.0 interface. Since both new uMCP modules incorporate four DRAM devices, they will allow the latest SoCs with quad-channel LPDDR4X memory controllers to reach up to 34.1 GB/s memory bandwidth. Meanwhile on the NAND side of matters, Samsung's official announcement doesn't list what storage capacities will be available there, but the company has commented that they can provide the uMCPs in a variety of capacities. Meanwhile, the new uMCP devices are also mechanically compatible with Samsung's previous-generation 8GB uMCPs, utilizing the same 254FBGA package. https://www.anandtech.com/show/15022...ufs-30-storage

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
1TB Samsung eUFS Chip For Smartphone Storage Revealed!	Stefan Mileschin	WebNews	0	31st January 2019 07:52
Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips	Stefan Mileschin	WebNews	0	12th November 2018 09:20
Samsung Starts Production of 16 Gb LPDDR4X Chips Using 2nd Gen 10nm Tech	Stefan Mileschin	WebNews	0	30th July 2018 08:04
Samsung's new DRAM chip will make phones run faster and longer	Stefan Mileschin	WebNews	0	19th July 2018 11:59
Samsung Announces First LPDDR5 DRAM Chip	Stefan Mileschin	WebNews	0	17th July 2018 09:24
Samsung launches first Exynos chip with all radios built in	Stefan Mileschin	WebNews	0	3rd September 2016 06:35
RunCore Launches First Single Chip SATA II DOM SSD	Stefan Mileschin	WebNews	0	29th June 2012 07:34
1 Gbit DRAM chip becoming standard	jmke	WebNews	0	25th October 2007 15:44
Samsung Develops First 50nm DRAM Chip	jmke	WebNews	0	20th October 2006 07:56
VIA Launches Single-Chip Embedded VIA CX700 Chipset	jmke	WebNews	0	4th April 2006 23:00