Stefan Mileschin

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions, today announced that it reached another milestone in the development of 14-nanometer (nm) FinFET process technology with the successful tape-out of multiple development vehicles in collaboration with its key design and IP partners. In addition, Samsung has signed an agreement with ARM for 14 nm physical IP and libraries. This agreement is the latest in a series from Samsung and ARM that has delivered production proven SoC enablement. Samsung, together with its ecosystem partners, is in a position to offer leading edge customers a robust design infrastructure to drive an ever expanding advanced mobile SoC market.

"As we move closer to true mobile computing, chip designers are eager to take advantage of the gains in performance and significantly lower power of 14 nm FinFET to deliver PC like user experience on a mobile device," said Dr. Kyu-Myung Choi, senior vice president of System LSI infrastructure design center, Device Solutions Division, Samsung Electronics. "The design complexities at 14 nm require complete harmony between the process technology, design methodology, tools and IPs. We are synchronizing all the key elements so our customers can deliver their newest chips to market quickly and efficiently."

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