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|25th September 2008, 23:39||#1|
Join Date: Nov 2004
OCZ Technology Introduces the HydroFlow CPU Waterblock for Liquid-Cooled Systems
Delft, Netherlands—September 25, 2008—OCZ Technology Group, Inc. (LSE: OCZ) a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled the “HydroFlow” HF-MK1 Waterblock for superior CPU watercooling. Designed with the highest possible exchange rate between the block and coolant, the HydroFlow can be easily integrated into any enthusiast water cooled system and help efficiently lower the processor temperature.
"The HydroFlow HF-MK1 targets the highest possible thermal exchange rate between a solid body and the surrounding fluid, while maintaining enough cross sectional area for superior thermal conductance within the fin structure,” commented Dr. Michael Schuette, V.P. of Technology Development at OCZ Technology. "Additionally, the relieved contact area concentrates the pressure on the actual die area of any processor, thereby minimizing the thermal interface material-induced loss in heat dissipation. In short, the HydroFlow epitomizes the recent advances in fluid cooling at an affordable price.”
The triangular fins in the HF-MK1 provide the highest volume to surface ratio of any geometric shape for best dissipation possible, and this special design also creates sufficient turbulence to eliminate the “skin” effect caused by laminar flow. The base block of the HydroFlow increases center contact with the processor core for the greatest possible cooling potential, ensuring maximum exchange and functionality between the waterblock and CPU.
Whether you’re a first-time builder or a seasoned case-modder, OCZ makes the HydroFlow easy to integrate into your rig by supplying both high-flow 3/8” and 1/2” barbs in the packaging without the hassle of searching for compatible hardware. The HydroFlow HF-MK1 is affordable with an MSRP of € 35 yet a technologically advanced solution to keep your processor functioning at optimal levels.
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