Stefan Mileschin

Looking at these two kits of memory from Mushkin shows that it has another pair of kits that deliver performance indicative of their specifications and more. First up are the distinctive good looks and functionality of the cooling solutions employed on each kit. The 32GB kit part number 994071 uses the "Ridgeback" design. This robust heatsink package uses a series of angle shaped (think Mushkin logo) fins on top of a thick body to effectively wick away the thermal load generated by these high density modules. Packing them into a four DIMM configuration like used in the testing will allow a higher heat load to be retained but is nothing to be concerned about. Using an air cooled CPU cooling solution would fix that issue as once air starts moving over the modules they cool down fast.

http://www.overclockersclub.com/revi...132gb_redline/