Sidney

Pat next focused on Intel’s current and future I/O innovations. He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0. According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects. He also held up a couple of pro-type USB 3.0 cables to show the room what they looked like.

http://www.hothardware.com/articles/...ngers_Keynote/

__________________
lazyman

Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II

Sidney

One of Intel’s many booths had quite a few interesting systems on display. Machines from CyberPower, Falcon Northwest, 3XS, Maingear, and a handful of other partners were being demoed in the booth, all featuring quad-core processors and Intel’s upcoming X38 chipset. The 3XS system really caught our eye, with its innovative chassis design and integrated CPU water cooling system. This machine was decked out with a Core 2 Extreme QX6850 quad-core chip, 2GB of RAM and dual ATI Radeon 2900 XTs in CrossFire.

http://www.hothardware.com/Articles/..._X38_and_More/

Taking place yesterday afternoon during Intel's Fall 2007 IDF
was their technology showcase and reception. There were a variety of
booths setup with all different manufacturers from American Megatrends
to Corsair and NVIDIA. While Microsoft did have a large presence at this
showcase, Intel did have a booth setup for talking about power-savings
technologies on Linux from their PowerTOP software to the tick-less
kernel and other power management capabilities.

http://www.phoronix.com/vr.php?view=11091

__________________
lazyman

Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II