| ||Thread Tools|
|31st August 2005, 14:21||#1|
Join Date: Mar 2004
JEDEC specs of FB-DIMM should be available by year-end
Micron Technology, a US-based manufacturer of DRAM and memory modules, expects that the standard specifications of fully-buffered DIMM (FB-DIMM) technology will be available to download from the JEDEC Solid State Technology Association (once known as the Joint Electron Device Engineering Council) website for non-member companies by year-end.
Micron is currently sampling FB-DIMM products to select customers and these products should begin to appear in production systems in the first half of 2006, according to Terry Lee, executive director of advanced technology and strategic marketing for Micronís system memory group.
So far, there is only one FB-DIMM related specification available for non-members through the JEDEC website. Describing the serial presence detect (SPD) values for FB-DIMMs, the specification is approved by the JEDEC Board of Directors and is now published in preliminary form, prior to being integrated into the appropriate JEDEC standard and published in final form.
While JEDEC has not yet adopted a final FB-DIMM standard, Micron has already published its own FB-DIMM specifications on the Micron website. In addition to recently announcing 4GB modules, Micron is currently sampling 12 DDR2 533 (PC2-4200) and DDR2 667 (PC2-5300) FB-DIMM products ranging in capacity from 256MB to 2GB. According to the specifications, the 240-pin FB-DIMMs are sized at 133.35◊30.35mm and utilize PCBs with a thickness of 1.27mm (see the full layout here). Answering about the PCB cost of FB-DIMMs compared to registered DIMMs, Lee stated that the total cost of an FB-DIMM PCB is not significantly higher.
According to an iSuppli forecast, FB-DIMM will account for 13% of OEM server module shipments in 2006 and 40% in 2007. Asked to comment this, Lee said that the forecast is within the range of Micronís understanding of the market. He did not mention any Taiwan company considered by Micron as a strong competitor in the FB-DIMM market and said that Micron will have multiple FB-DIMM sales channels including Crucial Technology, Micronís division focusing on the online sales of memory upgrades. Regarding advanced memory buffer (AMB), the key to FB-DIMM technology, Lee pointed out that Micron is now working with four AMB suppliers, but without naming them. According to him, the company also has its own internal AMB development.
Last week at the Intel Developer Forum (IDF), Micron demonstrated its 4GB FB-DIMM using 1Gbit DDR2 533 DRAM. The product was featured in the keynote of Pat Gelsinger, senior vice president and general manager of Intelís digital enterprise group. Earlier in August, Japanís Elpida Memory announced the availability of 4GB DDR2 533 and DDR2 667 FB-DIMMs (part numbers EBE41FE4AAHA-5C-E and EBE41FE4AAHA-6E-E). The new modules are now available for all customers in sample quantities, and volume production is scheduled for the fourth quarter, the company said.
Opteron 165 (2) @2.85 1.42 vcore AMD Stock HSF + Chill Vent II
|Thread||Thread Starter||Forum||Replies||Last Post|
|45% of Intelís Desktops Chips to Feature Nehalem Micro-Architecture by Year End||jmke||WebNews||0||11th February 2010 16:53|
|Intel to ship 100 millionth 45 nm CPU before year end||jmke||WebNews||0||16th July 2008 10:50|
|Intel Nehalem going mainstream by the end of the year||jmke||WebNews||1||13th June 2008 15:37|
|S3 Graphics Aims to Intro DirectX 10 Graphics Chips By Year End||jmke||WebNews||0||29th August 2007 18:26|
|AMD to Phase Out Socket 939 Chips by Year End||jmke||WebNews||0||18th October 2006 08:35|
|Hitachi Plans 1TB Hard Disk Drive for Year End||jmke||WebNews||0||16th August 2006 10:57|
|Intel: WiMAX cards by the end of this year||jmke||WebNews||0||8th March 2006 21:37|
|NVIDIA Vows to Bring Serial ATA-300 by Year End||jmke||WebNews||0||5th June 2004 03:47|
|Samsung Plans 2GHz GDDR3 Memory by Year End||jmke||WebNews||0||21st April 2004 11:56|