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JEDEC specs of FB-DIMM should be available by year-end JEDEC specs of FB-DIMM should be available by year-end
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Old 31st August 2005, 13:21   #1
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Default JEDEC specs of FB-DIMM should be available by year-end

Micron Technology, a US-based manufacturer of DRAM and memory modules, expects that the standard specifications of fully-buffered DIMM (FB-DIMM) technology will be available to download from the JEDEC Solid State Technology Association (once known as the Joint Electron Device Engineering Council) website for non-member companies by year-end.

Micron is currently sampling FB-DIMM products to select customers and these products should begin to appear in production systems in the first half of 2006, according to Terry Lee, executive director of advanced technology and strategic marketing for Micronís system memory group.

So far, there is only one FB-DIMM related specification available for non-members through the JEDEC website. Describing the serial presence detect (SPD) values for FB-DIMMs, the specification is approved by the JEDEC Board of Directors and is now published in preliminary form, prior to being integrated into the appropriate JEDEC standard and published in final form.

While JEDEC has not yet adopted a final FB-DIMM standard, Micron has already published its own FB-DIMM specifications on the Micron website. In addition to recently announcing 4GB modules, Micron is currently sampling 12 DDR2 533 (PC2-4200) and DDR2 667 (PC2-5300) FB-DIMM products ranging in capacity from 256MB to 2GB. According to the specifications, the 240-pin FB-DIMMs are sized at 133.35◊30.35mm and utilize PCBs with a thickness of 1.27mm (see the full layout here). Answering about the PCB cost of FB-DIMMs compared to registered DIMMs, Lee stated that the total cost of an FB-DIMM PCB is not significantly higher.

According to an iSuppli forecast, FB-DIMM will account for 13% of OEM server module shipments in 2006 and 40% in 2007. Asked to comment this, Lee said that the forecast is within the range of Micronís understanding of the market. He did not mention any Taiwan company considered by Micron as a strong competitor in the FB-DIMM market and said that Micron will have multiple FB-DIMM sales channels including Crucial Technology, Micronís division focusing on the online sales of memory upgrades. Regarding advanced memory buffer (AMB), the key to FB-DIMM technology, Lee pointed out that Micron is now working with four AMB suppliers, but without naming them. According to him, the company also has its own internal AMB development.

Last week at the Intel Developer Forum (IDF), Micron demonstrated its 4GB FB-DIMM using 1Gbit DDR2 533 DRAM. The product was featured in the keynote of Pat Gelsinger, senior vice president and general manager of Intelís digital enterprise group. Earlier in August, Japanís Elpida Memory announced the availability of 4GB DDR2 533 and DDR2 667 FB-DIMMs (part numbers EBE41FE4AAHA-5C-E and EBE41FE4AAHA-6E-E). The new modules are now available for all customers in sample quantities, and volume production is scheduled for the fourth quarter, the company said.

http://www.digitimes.com/bits_chips/a20050830PR207.html
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