Intel Reduces Size of S775 Reference Coolers
 

Intel has come up with a new design for its Fan Heat-sink Assembly (FHSA) it bundles with some (presumably dual-core) boxed socket LGA-775 processors. The new design aims at making it slightly more cost-effective by reducing the metal content, and trying to compensate with a more turbulent airflow design. While the forked aluminum fins in the old design project spirally from the base, in the new design they project radially. The CPU contact base is slightly smaller, and leveled to the fins.

http://www.tcmagazine.com/comments.p...=32948&catid=6