IBM to Produce Micron's First Commercial 3D Memory Chips
IBM and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM's advanced TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology. Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or "vias," shown above. IBM's new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.
|All times are GMT +1. The time now is 20:36.|
Powered by vBulletin® - Copyright ©2000 - 2019, Jelsoft Enterprises Ltd.
Content Relevant URLs by vBSEO