IBM cools 3D chips with integrated water channels
Why cool semiconductors with liquid on the surface when you can run water right through them? IBM believes that “tiny rivers of water” within stacked chips may not only advance Moore’s Law, but also pave the way to “green data centers”, significantly reducing the energy requirements by computers.
|All times are GMT +1. The time now is 04:31.|
Powered by vBulletin® - Copyright ©2000 - 2020, Jelsoft Enterprises Ltd.
Content Relevant URLs by vBSEO