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IBM cools 3D chips with integrated water channels
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IBM cools 3D chips with integrated water channels
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8th June 2008, 22:18
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| Madshrimp  Join Date: May 2002 Location: 7090/Belgium
Posts: 79,021
 |  IBM cools 3D chips with integrated water channels Why cool semiconductors with liquid on the surface when you can run water right through them? IBM believes that “tiny rivers of water” within stacked chips may not only advance Moore’s Law, but also pave the way to “green data centers”, significantly reducing the energy requirements by computers. http://www.tgdaily.com/content/view/37815/135/
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