HBM2 becoming more popular

Stefan Mileschin · 29th December 2017, 13:53

Thanks to Nvidia and AMD

Beancounters at Digitimes Research have added up some numbers and divided by their shoe size and worked out that HBM2 (second-generation high bandwidth memory) have been becoming more popular.

Th researchers found that the reason has been due to the adoption of such products by Nvidia's Tesla P100 accelerator and Quadro GP 100 graphics card as well as AMD's Radeon Vega chip.

In addition to HBM-based products, there is a variant version of HMC (hybrid memory cube) chips. While both HBM and HMC solutions are made with a similar vertical stacking process to integrate multilayer DRAM devices on a base logic die, the HBM is more like a 2.5D stacked-die packaging solution, and the HMC is closer to a 3D stacked-die packaging process.

SK Hynix and Samsung Electronics are using wafer-level packaging (WLP) process to fabricate HBM2-based chips, TSMC is using chip-on-wafer-on-substrate for HBM2 devices. Micron Technology and Chipzilla focus mainly on HMC-based products.

http://fudzilla.com/news/memory/4527...g-more-popular

29th December 2017, 13:53	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 148,553	HBM2 becoming more popular Thanks to Nvidia and AMD Beancounters at Digitimes Research have added up some numbers and divided by their shoe size and worked out that HBM2 (second-generation high bandwidth memory) have been becoming more popular. Th researchers found that the reason has been due to the adoption of such products by Nvidia's Tesla P100 accelerator and Quadro GP 100 graphics card as well as AMD's Radeon Vega chip. In addition to HBM-based products, there is a variant version of HMC (hybrid memory cube) chips. While both HBM and HMC solutions are made with a similar vertical stacking process to integrate multilayer DRAM devices on a base logic die, the HBM is more like a 2.5D stacked-die packaging solution, and the HMC is closer to a 3D stacked-die packaging process. SK Hynix and Samsung Electronics are using wafer-level packaging (WLP) process to fabricate HBM2-based chips, TSMC is using chip-on-wafer-on-substrate for HBM2 devices. Micron Technology and Chipzilla focus mainly on HMC-based products. http://fudzilla.com/news/memory/4527...g-more-popular

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