G.Skill Unveils Trident X Series DDR3-2400 MHz Modular-Heatsink Overclocking Memory
 

G.Skill unveiled its newest line of memory for extreme overclocking, the Trident X. Its launch is timed to follow that of Intel's Core "Ivy Bridge" processor family, and is optimized for 7-series chipset motherboards (due to their support of latest Intel XMP 1.3 specification). Pictured below is what Trident X series modules look like: a black PCB with a slightly long black metal heatsink, which has a detachable crown heatsink (red). One can notice a slot for heat pipes in the juncture between the crown heatsink and the module's main heatsink.

Aesthetically, the Trident X series modules don a black+red color scheme, which goes well with the black+red motherboard in the background (in the press-shot). Pictured below are the DDR3-2400 MHz (PC3-19200) modules in dual-channel configuration. The XMP profile runs the module at its 2400 MHz DDR (1200 MHz real) speed, with timings of 10-12-12-31T, and DRAM voltage of 1.65V. The modules will be available in various other speed/timing configurations, and in densities of 4 GB and 8 GB, making up for 8 GB and 16 GB dual-channel kits, for the new "Ivy Bridge" platform; 16 GB and 32 GB quad-channel kits for the Sandy Bridge-E platform. The older Sandy Bridge LGA1155 platform might not be 100% compatible, since it lacks XMP 1.3 support. G.Skill Trident X will be formally announced on May 4.

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