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28th July 2006, 14:41 | #1 |
Madshrimp Join Date: May 2002 Location: 7090/Belgium
Posts: 79,021
| Freescale Waves Goodbye to the BGA For those familiar with ball-grid array (BGA) packaging, things may be about to change with the way we package processors. BGA, the nearly ubiquitous packaging for small mobile devices has a new competitor. Earlier this week, Freescale announced a new packaging technology called Redistributed Chip Packaging.
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