EK Unveils the Indigo XS Ultra-Performance Engineered Thermal Interface

Stefan Mileschin · 22nd January 2014, 07:30

EK Water Blocks, Ljubljana-based premium water cooling gear manufacturer, is proud to introduce the latest latest generation Engineered Thermal Interface (ETI) for Intel Core LGA-115x processors.

EK-TIM Indigo XS is the successor to EK-TIM Indigo Xtreme and represents the latest generation Engineered Thermal Interface (ETI). Fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. Indigo XS achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.

http://www.techpowerup.com/197082/ek...interface.html

22nd January 2014, 07:30	#1
Stefan Mileschin [M] Reviewer Join Date: May 2010 Location: Romania Posts: 148,462	EK Unveils the Indigo XS Ultra-Performance Engineered Thermal Interface EK Water Blocks, Ljubljana-based premium water cooling gear manufacturer, is proud to introduce the latest latest generation Engineered Thermal Interface (ETI) for Intel Core LGA-115x processors. EK-TIM Indigo XS is the successor to EK-TIM Indigo Xtreme and represents the latest generation Engineered Thermal Interface (ETI). Fits neatly between a CPU lid and water block (or heat sink) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. Indigo XS achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance. http://www.techpowerup.com/197082/ek...interface.html

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