Battle of the Goop - Thermal Paste Comparison

jmke · 5th August 2006, 14:39

Today we take a look at 4 of the top thermal interface compounds from Arctic Silver, Shin-Etsu and Coollaboratory to find out if there are benefits to be had by switching your goop!

[attachment]

Quite a difference, but not worth switching out your thermal paste for in my humble opinion; if your CPU needs to be 5°C "cooler" in order to work correctly, something else is up. If however you are building a new system, that Coollaboraty Liquid Pro does look interesting; anybody seen tests on how it does over time? Would it evaporize/harden/... ?

Rutar · 5th August 2006, 15:19

I've seen testing where MX-1 was able to beat AS5 by a few degrees.

MX1 has the bonuses of being non-conudctive and non-capacitve, easier to apply, ok for aluminium parts and it hardens out so it remains good for years.

5th August 2006, 14:39	#1
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 82,497	Battle of the Goop - Thermal Paste Comparison Today we take a look at 4 of the top thermal interface compounds from Arctic Silver, Shin-Etsu and Coollaboratory to find out if there are benefits to be had by switching your goop! [attachment] Quite a difference, but not worth switching out your thermal paste for in my humble opinion; if your CPU needs to be 5°C "cooler" in order to work correctly, something else is up. If however you are building a new system, that Coollaboraty Liquid Pro does look interesting; anybody seen tests on how it does over time? Would it evaporize/harden/... ?

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5th August 2006, 15:19	#2
Rutar Member Join Date: Apr 2005 Posts: 2,267	I've seen testing where MX-1 was able to beat AS5 by a few degrees. MX1 has the bonuses of being non-conudctive and non-capacitve, easier to apply, ok for aluminium parts and it hardens out so it remains good for years.