jmke

AMD, in its presentation at the International Solid State Circuits Conference (ISSCC) 2010, presented its plan to build its much talked about 'Fusion' processor platform, codenamed Llano, central to which, is the Accelerated Processing Unit (APU). AMD's APU is expected to be the first design to embed a multi-core x86 CPU and a GPU onto a single die. This design goes a notch ahead of Intel's recently released 'Clarkdale' processor, where Intel strapped a 32 nm dual-core CPU die and a 45 nm northbridge die with integrated graphics, onto an MCM (multi chip module) package. Llano is also expected to feature four processing cores, along with other design innovations.

Some of the most notable announcements in AMD's presentation is that the company will begin sampling the chip to its industry partners within the first half of 2010. The Llano die will be build on a 32 nm High-K Metal Gate process. On this process, each x86 core will be as small as 9.69 mm². Other important components on the Llano die are a DDR3 memory controller, on-die northbridge, and a DirectX 11 compliant graphics core derived from the Evergreen family of GPUs. The x86 cores are expected to run at speeds of over 3 GHz. Each core has 1 MB of dedicated L2 cache, taking the total chip cache size to 4 MB.

http://www.techpowerup.com/114890/AM...n_H1_2010.html

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