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AMD: Problems with 32nm SOI Process Technology Are Behind AMD: Problems with 32nm SOI Process Technology Are Behind
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AMD: Problems with 32nm SOI Process Technology Are Behind
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Old 12th November 2010, 09:44   #1
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Default AMD: Problems with 32nm SOI Process Technology Are Behind

Advanced Micro Devices has had major issues with the 32nm silicon-on-insulator process technology. As a result of those problems, the yields of the company's code-named Llano accelerated processing units (APUs) were so low that the company had to delay them by many months. Besides, those problems affected release schedule of next-gen Bulldozer micro-processors. But the issues seem to be largely behind AMD.
"We had been having slow kind of ramp of the yield curve [with 32nm SOI]. [...] I can tell you today that we are now [on the ramp take off part] of the yield curve. Our 32nm is healthy and it is ramping up to support our product launches next year," said Chekib Akrout, senior vice president of technology group at AMD, during the company's conference with financial analysts.
As previously reported, AMD currently promises its partners to start mass production of its eight-core code-named Zambezi processor for desktops using 32nm SOI fabrication process in April, 2011. The chip will be not only AMD's first central processing unit made using 32nm SOI at Globalfoundries, but it will be the first processor based on the highly-anticipated Bulldozer micro-architecture. The Zambezi product will be released to market in Q2, according to Mr. Akrout, whereas its server brethren will see the light of the day in Q3 2011.
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