3-D Chips: IBM Moves Moore's Law Into The Third Dimension

jmke · 15th April 2007, 21:33

IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.

http://www.sciencedaily.com/releases...0412132140.htm

Kougar · 16th April 2007, 07:44

I guess its finally happened.

Any thoughts on if AMD might be interested in licensing the techniques for future chips within ~5 years?

jmke · 16th April 2007, 07:54

although the tech is "cool", multi-cores don't really speed up most software out there

Kougar · 16th April 2007, 13:29

Ah, but I don't mean multi-cores. I meant regarding 3d chip fabbing... considering the sizes of the G80 and R600 cores, using a 3D chip design would greatly ease issues of increasing higher clockrates while helping shrink the required dimensions a bit at the same time.

Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away.

15th April 2007, 21:33	#1
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 82,473	3-D Chips: IBM Moves Moore's Law Into The Third Dimension IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems. http://www.sciencedaily.com/releases...0412132140.htm __________________

16th April 2007, 07:54	#3
jmke Madshrimp Join Date: May 2002 Location: 7090/Belgium Posts: 82,473	although the tech is "cool", multi-cores don't really speed up most software out there __________________

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16th April 2007, 07:44	#2
Kougar Member Join Date: Jun 2006 Posts: 1,640	I guess its finally happened. Any thoughts on if AMD might be interested in licensing the techniques for future chips within ~5 years?

16th April 2007, 13:29	#4
Kougar Member Join Date: Jun 2006 Posts: 1,640	Ah, but I don't mean multi-cores. I meant regarding 3d chip fabbing... considering the sizes of the G80 and R600 cores, using a 3D chip design would greatly ease issues of increasing higher clockrates while helping shrink the required dimensions a bit at the same time. Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away.