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|15th April 2007, 20:33||#1|
Join Date: May 2002
3-D Chips: IBM Moves Moore's Law Into The Third Dimension
IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
|16th April 2007, 12:29||#4|
Ah, but I don't mean multi-cores. I meant regarding 3d chip fabbing... considering the sizes of the G80 and R600 cores, using a 3D chip design would greatly ease issues of increasing higher clockrates while helping shrink the required dimensions a bit at the same time.
Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away.
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