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15th April 2007, 21:33 | #1 |
Madshrimp Join Date: May 2002 Location: 7090/Belgium
Posts: 79,020
| 3-D Chips: IBM Moves Moore's Law Into The Third Dimension IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems. http://www.sciencedaily.com/releases...0412132140.htm
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16th April 2007, 07:44 | #2 |
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| I guess its finally happened. Any thoughts on if AMD might be interested in licensing the techniques for future chips within ~5 years? |
16th April 2007, 07:54 | #3 |
Madshrimp Join Date: May 2002 Location: 7090/Belgium
Posts: 79,020
| although the tech is "cool", multi-cores don't really speed up most software out there
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16th April 2007, 13:29 | #4 |
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| Ah, but I don't mean multi-cores. I meant regarding 3d chip fabbing... considering the sizes of the G80 and R600 cores, using a 3D chip design would greatly ease issues of increasing higher clockrates while helping shrink the required dimensions a bit at the same time. Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away. |
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