3-D Chips: IBM Moves Moore's Law Into The Third Dimension
 

IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.

http://www.sciencedaily.com/releases...0412132140.htm

I guess its finally happened. :) Any thoughts on if AMD might be interested in licensing the techniques for future chips within ~5 years?

although the tech is "cool", multi-cores don't really speed up most software out there :(

Ah, but I don't mean multi-cores. I meant regarding 3d chip fabbing... considering the sizes of the G80 and R600 cores, using a 3D chip design would greatly ease issues of increasing higher clockrates while helping shrink the required dimensions a bit at the same time.

Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away.