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@ 2011/11/22Winbond Electronics released a new line of serial peripheral interface flash (SPI Flash) memory chips designed to have tiny board footprints (sizes). 8-pin SPI Flash memory chips are in almost every part of today's computers, be it the chip that stores motherboard or VGA BIOS, the one that stores third-party controller firmware, or even boot ROM of network cards. Its applications get even broader with consumer electronics devices. Winbond launched new 8-pin SPI Flash chips in ultra-thin small-outline no-lead (USON) and wafer-level-ball-grid-array (WLBGA) form-factors, that have 20% smaller board footprints than common WSON and SOIC packages.
Winbond's new 6 mm² USON SPI Flash chips come in sizes of 512 Kb, 1 Mb, 2 Mb, 4 Mb, and 8 Mb, and with voltage options of common 2.5V and 3V. Low-power 1.8V options are available, too. The WLBGA SPIFlash chips will be available in 8 Mb and 16 Mb capacities, with package sizes of 3.4 mm² and 4.8 mm², respectively. Currently these chips are built on the more common 90 nm bulk manufacturing process, but Winbond expects to transition to 58 nm bulk process, driving down costs, in the future.
Winbond's new 6 mm² USON SPI Flash chips come in sizes of 512 Kb, 1 Mb, 2 Mb, 4 Mb, and 8 Mb, and with voltage options of common 2.5V and 3V. Low-power 1.8V options are available, too. The WLBGA SPIFlash chips will be available in 8 Mb and 16 Mb capacities, with package sizes of 3.4 mm² and 4.8 mm², respectively. Currently these chips are built on the more common 90 nm bulk manufacturing process, but Winbond expects to transition to 58 nm bulk process, driving down costs, in the future.
