GloFo, Samsung partner up on high-perf 28-nm process

@ 2011/08/31
Last year, the two companies, along with IBM and STMicroelectronics, announced plans to sync up their fabs to facilitate production using a low-power, 28-nm HKMG process. Today, GlobalFoundries says it's teaming up with Samsung on a high-performance, low-leakage 28-nm HKMG manufacturing process that complements the low-power process announced in 2010.

This new, high-power process was "specifically developed for mobile applications," and it purportedly offers "60 percent of active power reduction at the same frequency or 55 percent of performance boost at the same leakage over 45nm low power (LP) SoC designs." GlobalFoundries sees the process as suitable for high-end smart phones, tablets, and even notebooks.

No comments available.