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@ 2010/11/04Intel, Toshiba, and Samsung have joined forces to develop technologies to bring process sizes down as low as 11nm, with planned facilities to include research labs and a manufacturing facility in Japan.
The deal, which was reported in Japanese newspaper The Nikkei this weekend, sees the three companies combine their efforts and launch a new initiative which aims to solve some of the problems with the ever-shrinking process size in the semiconductor market.
Although Intel is still working on launching its 22nm-based CPUs, it's clearly looking ahead. Thankfully, it won't be working on the problem alone, as the three companies will be joining staff, facilities, and money together to crack the next big step in semiconductor evolution.
The deal, which was reported in Japanese newspaper The Nikkei this weekend, sees the three companies combine their efforts and launch a new initiative which aims to solve some of the problems with the ever-shrinking process size in the semiconductor market.
Although Intel is still working on launching its 22nm-based CPUs, it's clearly looking ahead. Thankfully, it won't be working on the problem alone, as the three companies will be joining staff, facilities, and money together to crack the next big step in semiconductor evolution.
