MD to integrate USB 3.0 support in upcoming chipsets

@ 2010/07/28
AMD is currently in talks with Renesas Electronics, which was merged with Japan-based NEC, about the licensing of USB 3.0 technology, and is considering integrating USB 3.0 support in its upcoming Hudson D1 southbridge chipsets, according to sources from notebook makers.

The Hudson D1 chipset will be introduced for AMD's 40nm Ontario APUs that are set to be shipped in the fourth quarter of 2010. The new platform will mainly target the ultra-thin notebook and netbook markets.

In 2011, AMD will launch Llano-based processors for its mainstream desktop and notebook segments.

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