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@ 2010/06/17Toshiba Corp. has announced the launch of a 128GB embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest eMMC standard, and is designed for smartphones, tablet PCs and digital video cameras.
The new 128GB embedded device integrates sixteen 64Gb (8GB) NAND chips fabricated with Toshiba's 32nm process technology and a dedicated controller into a small package only 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gb NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.
The new 128GB embedded device integrates sixteen 64Gb (8GB) NAND chips fabricated with Toshiba's 32nm process technology and a dedicated controller into a small package only 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gb NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.
