UMC Begins to Ship 40n Chips

The products were manufactured with excellent cycle time and yields for the large die-size programmable logic chips, which leveraged the foundry's triple-gate oxide, 12 metal layers and copper/low-k technology to enable 65% reduced power consumption and more than twice the density improvement over previous 65nm generation products. The advanced 40nm ICs have already begun shipping in volume to the customer's end users for product sampling.

“UMC continues to remain at the forefront of semiconductor foundry technology through the timely delivery of leading-edge processes that meet the demanding requirements of today's advanced applications. The delivery of these 40nm customer products underscores this technology commitment, we look forward to bringing the performance advantages of our proven 40nm technology to even more UMC customers,” said S.C. Chien, vice president of advanced technology development at UMC.