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Follow us on FacebookFancy images prove HSF Lapping Drops CPU Temperature
@ 2008/06/25Heatsink lapping has been used as one means to improve heatsink performance. As part of evaluations IC Diamond is doing to better understand user thermal grease performance data, a special pressure sensitive film from Sensor Products was given to a number of users in different forums who agreed to participate in this test using their own PCs as a test bed.
The test involved first inserting the pressure film between the heatsink and CPU and bolting the heatsink on. The film was sent to Sensor Products for data analysis - it records pressures on the IHS from 30 to 90 pounds which is translated into data and images for analysis by Sensor Products. After lapping, a new film was used again to record the difference in contact area and pressure. For each test, IC Diamond was applied and temperatures were recorded.
The test involved first inserting the pressure film between the heatsink and CPU and bolting the heatsink on. The film was sent to Sensor Products for data analysis - it records pressures on the IHS from 30 to 90 pounds which is translated into data and images for analysis by Sensor Products. After lapping, a new film was used again to record the difference in contact area and pressure. For each test, IC Diamond was applied and temperatures were recorded.
