Mushkin Launches Ascent, High-End Memory Line

Mushkin Introduces “Ascent,” New High Performance Memory Line with State-of-the Art Cooling Technology from Celsia

Ascent Redline and Ascent XP offer PC Enthusiasts a New Level of Performance

DENVER, CO May 6, 2008 – Mushkin, Inc. (www.mushkin.com), a global leader in high-performance computer products, announced the launch of a new high performance line of memory modules aimed at the power gamer market. Called Ascent, the new line raises the bar on its Redline and XP premium memory offering by using eVCI (enhanced Vapor Chamber Interface) cooling technology, the current state-of-the-art in heat spreaders.

“By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance,” said Brian Flood, director of product development for Mushkin. “The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia’s new eVCI technology.”*

At the heart of Mushkin’s eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies (