Intel Samsung and TSMC plan 450mm Wafers

Intel has reached an agreement with Samsung Electronics and TSMC to try to make 450mm sized wafers and to start the production with these much bigger wafers in 2012.

This transition will help Intel and others to grow the semiconductor industry and more space you have on the wafer will get you more chips and eventually more profit.

Currently the best that Intel and everyone else can do is 300mm wafer and with 450mm you will be able to place more than two times as many chips.