The Secrets of Memory: Part 2

Major changes are expected in 2010 and 2011 as the industry moves into 45nm fabrication, 450mm wafer, 45 micro metre wafer thickness and 3D chip packaging technology. There are many concerns made by companies when technology goes through a paradigm shifts, mostly related to the costs of equipment replacement or retooling, and the degradation of electrical properties in some materials at 45nm or smaller.