3-D Chips: IBM Moves Moore's Law Into The Third Dimension
@ 2007/04/15IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology – called ''through-silicon vias''-- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
Knowing how the R700 core is planned to be designed I guess it doesn't matter, but it can still give AMD one edge against Intel that Nehalem won't be taking away.