Aerocase Announces Two New, High-Performance, SFF and HTPC Enclosures

@ 2006/08/03
Petaluma, CA. August 3, 2006 – Aerocase, Inc. today announced their Cool-Wings TM Passive Enclosures, designed for the Home Theater PC (HTPC) and Small Form Factor (SFF) markets.

These new PC enclosures provide massive external heatsinks to passively cool both the CPU and video card without the need for fans.

Aerocase’s line of Cool-Wings Passive Enclosures utilize the Company’s proven heatpipe technology and patented V-Degree TM thermal transfer systems, which enable these external heatsinks to dissipate over 140 watts per side. Each of the large matching heatsinks on either side of the PC enclosure is fed by 4 heatpipes; one side for the CPU and the other for the Video GPU.

“As computing power increases, so does heat,” said President and CEO, Katherine Dean. “The only real solution to this problem is to dissipate this heat outside the case. These new passively cooled cases allow the HTPC and Silent Computing enthusiast to significantly reduce the amount of noise coming from their media center or small form factor PC to almost to zero.”

Product availably is scheduled for November 1s t, 2006 directly from the manufacturer, with a list price of $495.95 for the HTPC and $395.95 for the Aria SFF enclosure. A reseller program will also provide dealer pricing beginning November 1st, 2006.

Aerocase, Inc. is headquartered in Sheridan, Wyoming, with R&D offices in Petaluma, California. The Company was founded in 2005 by an all woman management group and an aerospace engineering team. Additional information can be found at

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