Samsung creates a new GDDR6 memory

@ 2022/12/01
FOWL play expected

Samsung has introduced a new GDDR6 memory that doubles the DRAM package's capacity and increases interface width to double its peak bandwidth.

Dubbed the GDDR6W, the chips use traditional BGA packaging and will end up in mainstream applications.

At the moment, GDDR6 and GDDR6X chips integrate a DRAM device with a 32-bit interface, while the GDDR6W chip has two DRAM devices and two 32-bit interfaces. The capacity doubles from 16Gb to 32Gb and the interface width from 32-bits to 64-bits.

Samsung sang that it managed to pull this feat off using its Fan-Out Wafer-Level Packaging (FOWLP) technology that replaces traditional printed circuit board with a redistribution layer (RDL) that is thinner and has finer wiring.

Samsung's GDDR6W devices generally use the same protocols as GDDR6 but offer higher performance and capacity. A 32Gb GDDR6W memory chip could deliver a peak bandwidth of 176 GBps, up from 88 GBps in the case of a regular GDDR6 SGRAM chip. Meanwhile, building a 32Gb memory chip using two 16Gb memory devices might be cheaper than building a 32Gb monolithic memory device.'

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