Cooler Master Introduces New Thermal Compound@ 2005/12/29
Being a true innovator in providing PC thermal solution, Cooler Master considers every aspect of cooling, including providing the best solution for a small air gap. NanoFusion - the revolutionary thermal compound newly released by Cooler Master - surpasses every overclocker’s expectation in terms of its Bond Line Thickness (BLT), Thermal Conductivity, Thermal Resistance and Specific Gravity. With the accomplished 0.019mm BLT, NanoFusion has successfully minimized thermal resistance to to 0.065℃-cm 2/w@40psi, which has been proven to be unmatched by any other thermal grease in the market.
Besides providing the best performance, NanoFusion is also environmentally safe, meeting the increasing demand of RoHS requirements. In addition, NanoFusion is comprised of non-electrical conductive material, to prevent system short circuitry. NanoFusion has all that you would need to reach your desired cooling results. It is definitely a crucial component to your precious system that any overclockers cannot miss.