Intel's new processor has big and little cores

@ 2018/12/13
10nm and 22nm on the 3D Foveros package

Raja Koduri, ex ATI, AMD, Apple and now Intel’s senior vice president of Core and Visual Computing, outlined a strategic shift in the company’s design and engineering models.

The "new" Intel has decided to think out of the box, after years of making strictly Atom based low power processors or high-performance Core processors and never mixing them. Now they have an idea to make a processor featuring both low power and high performance in one place.

This is possible thanks to Intel's Foveros 3D packaging technology that allows stacking and interconnecting different dies on the same package. In this case, the cores sit on top of each other. Intel was able to demonstrate a custom design for an unnamed customer. This is Intel’s solution to a fanless design that might end up in a modern detachable or even a tablet.

The 10nm CPU cores with GPU, caches and any other accelerator sit on top of the 22nm that house I/O, SRAM and the power circuitry sit below.

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