Toshiba Samples New UFS 2.1 NAND: Up to 900 MB/s Reads For 2018 Smartphones

@ 2017/12/06
Toshiba has announced that it had started sample shipments of its latest UFS storage devices based on its 64-layer BICS3 3D TLC NAND memory. The new devices are compliant with the UFS 2.1 specification and can offer very high performance for demanding mobile devices, such as smartphones, tablets, and VR headsets.

Toshiba did not reveal when it plans to ship its UFS 2.1 storage devices powered by BICS3 3D TLC memory in its press release, but it is logical to expect the chips to end up inside 2018 smartphones and other devices. Earlier this year some makers of handsets suffered from shortages of NAND flash in general and UFS 2.0/2.1 devices in particular, so Toshiba’s upcoming launch of its new UFS 2.1 storage will be appreciated by the industry.

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