Toshiba Samples 64-Layer 512 Gb BiCS 3D NAND

@ 2017/02/26
Toshiba on Wednesday said that it had begun to sample its latest BiCS 3D NAND flash memory chips with 64 word layers and 512 Gb capacity. A co-development project with Western Digital, the two companies intend to produce the new ICs (integrated circuits) in high volume sometimes in the second half of this year. Among the first products to use the new chips will be Toshiba’s BGA SSD with 1 TB capacity.

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