Follow us on Twitter
Follow us on FacebookIntel to add Wi-Fi and USB 3.1 functionality in 300-series
@ 2016/11/13AMD placing USB 3.1 chipset orders as well
According to sources from motherboard makers, Intel is planning to add USB 3.1 and Wi-Fi functionality to its upcoming 300-series motherboard series scheduled to be released at the end of 2017.
The 200-series motherboard chipsets for Kaby Lake CPUs arriving in early 2017 will contain a few I/O side improvements including 24 PCI-E 3.0 lanes, six native SATA III 6Gbps ports and ten USB 3.0 ports, while it will offer native USB 3.1 support later in the 300-series platform towards the end of the year.
According to sources from motherboard makers, Intel is planning to add USB 3.1 and Wi-Fi functionality to its upcoming 300-series motherboard series scheduled to be released at the end of 2017.
The 200-series motherboard chipsets for Kaby Lake CPUs arriving in early 2017 will contain a few I/O side improvements including 24 PCI-E 3.0 lanes, six native SATA III 6Gbps ports and ten USB 3.0 ports, while it will offer native USB 3.1 support later in the 300-series platform towards the end of the year.
