HBM3 and GDDR6 emerge fresh from the oven of Hot Chips

The Hot Chips conference is going strong in Cupertino, California, and the first juicy tidbits of information have started popping up from folks at the event. According to sites reporting from the conference, SK Hynix and Samsung talked about the new generation of High-Bandwidth Memory, aptly called HBM3.

HBM3 improves on the current-generation HBM2 in nearly every regard. It'll use dies with higher capacity and bandwidth. Each die should now pack 16Gb (2GB) per layer, meaning it's possible we'll eventually see graphics cards with up to 64GB of HBM3 on board. As a point of reference, ...