Intel-Micron Share Additional Details of Their 3D NAND

@ 2015/03/27
Today must be the busiest day in the world of NAND. Earlier today, Toshiba announced that it has begun shipments of its 48-layer 128Gbit 3D NAND part and now a few hours later Intel and Micron held a joint webinar that revealed a few new details about the companies' 3D NAND process. Intel-Micron originally unveiled their 3D NAND in November last year and disclosed that the first generation product will be a 32-layer 256Gbit (32GB) MLC part, which can also operate in TLC mode to bring the capacity per die to 384Gbit (48GB).

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