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@ 2015/03/27The 3D NAND race is heating up. Samsung has been shipping its 3D NAND products for over six months now, but so far we have known very little about the others' 3D NAND technology. With today's announcement, Toshiba is shedding some light to its 3D NAND strategy by announcing that the company has started sampling a 48-layer 128Gbit (16GB) part.
Toshiba's 3D NAND structure (and also SanDisk's since the two have a NAND joint-venture) is called BiCS, which is abbreviation for Bit Cost Scaling. Similar to Samsung's TCAT structure, BiCS abandons the traditional floating gate design and utilizes a charge trap made out of insulating material to reduce electron leakage. From a structure and manufacturing standpoint, BiCS is quite different from TCAT, but given the amount of time and research required for a thorough analysis I'll save that for a later date. In the mean time, if you need a refresher on 3D NAND in general and Samsung's TCAT structure, I suggest you read our Samsung 850 Pro SSD review.
Toshiba's 3D NAND structure (and also SanDisk's since the two have a NAND joint-venture) is called BiCS, which is abbreviation for Bit Cost Scaling. Similar to Samsung's TCAT structure, BiCS abandons the traditional floating gate design and utilizes a charge trap made out of insulating material to reduce electron leakage. From a structure and manufacturing standpoint, BiCS is quite different from TCAT, but given the amount of time and research required for a thorough analysis I'll save that for a later date. In the mean time, if you need a refresher on 3D NAND in general and Samsung's TCAT structure, I suggest you read our Samsung 850 Pro SSD review.
