Intel's 3D NAND has 32 layers and 256Gb per die

During an investor webcast this afternoon, Intel revealed that it will offer SSDs based on 3D NAND in the second half of next year. The three-dimensional tech is the product of the firm's joint flash venture with Micron. It stacks 32 planar layers to deliver 256Gb (32GB) of storage in a single MLC die. The 3D NAND can also be packed with three bits per cell to hit 384Mb (48GB) per die.

According to Rob Crooke, senior VP and general manager of Intel's non-volatile memory group, the 3D NAND will enable 10TB SSDs "within the ...