Hynix slides tease vertically stacked memory with 256GB/s of bandwidth

High-Bandwidth Memory, otherwise known as HBM, is a form of stacked DRAM designed to sit on the same package as a processor. Hynix has been working on the technology with AMD, and there's already a JEDEC standard governing the interface. Now, official-looking Hynix presentation slides linked on Reddit provide new insight into how this stacked memory works—and what the future holds.

According to the slides, Hynix's first-gen implementation stacks four DRAM dies on top of a single base layer. The dies are linked by vertical channels called through-silicon vias. By my count, there are 256 of those per slice, each one ...