Next-gen MSI OC Series Motherboard to Feature "Delid Die Guard"

The upcoming entries to MSI's more overclocker-oriented line of motherboards, the M-Power and X-Power OC Series, will feature an interesting new feature that could appeal to overclockers that like to de-lid (remove the IHS of) their processors, for more direct heat-transfer between the chip and cooler. Called the "Delid Die Guard," the accessory is a replacement LGA socket brace that runs its way around the die, and not the edges of the package. The thickness of the brace puts it at the exact level of the surface of the chip (much like the support braces GPUs come with), and so it prevents heavy coolers (think chunky LN2 pots) from pressing too hard against the die, potentially breaking it. The feature could debut on MSI's upcoming M-Power motherboard based on the Z97 Express chipset.