Toshiba Expands its Semiconductor Facility at Yokkaichi

@ 2013/07/02
Toshiba Corporation today announced that it will expand its state-of-art No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories. Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

Yokkaichi Operations currently has three Fabs mass producing NAND flash memory, including Fab 5 phase 1. Fab 5's construction was planned around two phases, the first of which went into operation in July 2011. After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers and other new applications, Toshiba now anticipates further medium- to long-term market expansion and recognizes that the time is right to expand Fab 5.

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