Follow us on Twitter
Follow us on FacebookSilicon Power Presents the New Generation of Xpower DDR3 Memory
@ 2013/05/09Silicon Power, the world's leading provider of memory storage solutions today unveils the new generation of Xpower DDR3 Overclocking series memory module. Built in a special-made metallic heat sink, the new Xpower DDR3 is able to provide a better cooling solution and increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.
Silicon Power new Xpower DDR3 Overclocking series are available in various duel channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, reaching the high capacity from 8 GB (4 GBx2) to 16 GB (8 GBx2). Compatible with Intel Core Gen 3 and the latest Z77 platform, Xpower Overclocking series can maximize the transfer speed, unleashing the extreme system performance to the next level.
Silicon Power new Xpower DDR3 Overclocking series are available in various duel channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, reaching the high capacity from 8 GB (4 GBx2) to 16 GB (8 GBx2). Compatible with Intel Core Gen 3 and the latest Z77 platform, Xpower Overclocking series can maximize the transfer speed, unleashing the extreme system performance to the next level.
