VIA Enters License Agreement with 3Com

@ 2004/11/26
VIA Technologies, a successful chipset designer, and 3Com Corporation, a leading networking and communication maker, announced that the two companies have entered into a patent license agreement that grants VIA rights under certain 3Com patents.

The agreement covers the licensing of specified 10/100 Ethernet controller semiconductors developed and sold by VIA and its subsidiaries.

“Networking products constitute a key element of our platform strategy, comprising a broad range of discrete and integrated Ethernet controller solutions for ultimate flexibility for our customers,” said Steven Lee, Executive Assistant to the VIA President, and CEO of VIA Networking Technologies.

While the specific terms of the license are confidential, the agreement covers past and future sales of VIA’s licensed products. Under the terms of the agreement, VIA will make on-going royalty payments based on future sales.

“This agreement with 3Com strengthens our ability to compete and provides our customers with an edge in this marketplace, enabling us to offer industry-leading technology as part of our portfolio,” Mr. Lee added.

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